Deep trench isolation structure and method of making the same

ABSTRACT

A semiconductor structure can include a high voltage region, a first moat trench isolation structure electrically insulating the high voltage region from low voltage regions of the semiconductor structure, and a second moat trench isolation structure electrically insulating the high voltage region from the low voltage regions of the semiconductor structure. The first moat trench isolation structure can include dielectric sidewall spacers and a conductive fill material portion located between the dielectric sidewall spacers. The second moat trench isolation structure can include only at least one dielectric material, and can include a dielectric moat trench fill structure having a same material composition as the dielectric sidewall spacers and having a lateral thickness that is greater than a lateral thickness of the dielectric sidewall spacers and is less than twice the lateral thickness of the dielectric sidewall spacers.

RELATED APPLICATIONS

This application claims priority to U.S. patent application Ser. No.16/743,300, entitled “Deep Trench Isolation Structure and Method ofMaking the Same” filed on Jan. 15, 2020, the entire contents of whichare hereby incorporated by reference for all purposes.

BACKGROUND

The present disclosure is directed to semiconductor structures, andspecifically to a deep trench isolation structures for semiconductorstructures and methods of forming the same.

Bipolar/CMOS/DMOS (BCD) devices include a bipolar region to performanalog functions, a complementary metal oxide semiconductor (CMOS)region to perform digital functions and a double diffused metal oxidesemiconductor (DMOS) region which include power and high-voltageelements to provide power. BCD devices are used in communicationsapplications such as in smart phones and tablets as well as inautomotive application, e.g. for mirror positioning, seat adjustment,etc. By integrating three distinct types of components on a single die,BCD technology may reduce the number of components in the bill ofmaterials (BoM). Fewer chip components in the BoM further reduces thearea on the board, thus driving down costs. However, integratingdifferent types of components that operate at different voltages canpresent challenges in electrical isolation.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a partial see-through top-down view of a first exemplarystructure including a dual moat trench isolation structure in accordancewith some embodiments. A dielectric material layer and details ofsemiconductor structures are not illustrated for clarity.

FIG. 1B is a vertical cross-sectional view of the first exemplarystructure of FIG. 1A.

FIG. 2A is a partial see-through top-down view of a second exemplarystructure including a triple moat trench isolation structure inaccordance with some embodiments. A dielectric material layer anddetails of semiconductor structures are not illustrated for clarity.

FIG. 2B is a vertical cross-sectional view of the first exemplarystructure of FIG. 2A.

FIG. 3 is a plan view of a semiconductor structure comprising a deeptrench isolation structure in accordance with some embodiments.

FIG. 4 is a schematic illustration of the structure of FIG. 3.

FIG. 5 is a flow diagram of methods of making deep trench isolationstructure in accordance with some embodiments.

FIGS. 6A-6H are schematic diagrams illustrating methods of making deeptrench isolation structure in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thestructure in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The structures and method of the present disclosure can be used toprovide electrical isolation between regions of a semiconductor chipwhich operate at different voltages. The development of 10 nanometertransistors has led to the breakdown of Moore's law. In response,semiconductor chip designers are focusing their efforts on integratingdifferent types of semiconductor devices on a single chip. For example,a single semiconductor chip, such as a BCD chip, may have an analogregion comprising bipolar junction transistors, a digital logic regioncomprising complementary metal oxide semiconductor (CMOS) transistorsand a power region comprising double diffused metal oxide semiconductor(DMOS) transistors. By combining the functionality that had previouslybeen on separate chips into a single integrated chip, the number ofchips may be reduced. Consequently, real estate on circuit boards may befreed up as fewer chips may be required. Thus, the cost of assembly mayalso be lowered.

However, the various semiconductor devices placed in close proximity toone another may utilize different voltages in operation. For example, insome embodiments, the DMOS transistors may have an operating voltage ina range from 50 volts to 1,000 volts. In contrast, the bipolar or CMOStransistor devices may have an operating voltage less than 50 V, and/orless than 24 V, and/or less than 12 V, and/or less than 6 V. By placingthe high voltage devices in close proximity to the low voltage devices,significant damage may occur to the low voltage devices. Thus,structures to isolate the high voltage devices from the low voltagedevices may be employed to protect the low voltage devices.

With reference to FIGS. 1A and 1B, a first exemplary semiconductorstructure 10 including a dual moat trench isolation structure inaccordance with some embodiments is disclosed. In an embodiment, thefirst exemplary structure includes a handle substrate 100, a buriedinsulator layer 102 and a semiconductor device layer including varioussemiconductor substrate material portions (104A, 104B, 104C). At leasttwo nested moat trenches may be formed to laterally divide the varioussemiconductor substrate material portions (104A, 104B, 104C). The atleast two nested moat trenches include a first moat trench located onthe outside and a second moat trench located on the inside. In oneembodiment, the first moat trench may have a first width w1, and thesecond moat trench can have a second width w2. The first width w1 may begreater than the second width w2. In one embodiment, the first width w1may be greater than twice the second width w2.

The various semiconductor substrate material portions (104A, 104B, 104C)may include a first semiconductor substrate material portion 104A thatis laterally surrounded by the second moat trench, a secondsemiconductor substrate material portion 104B that is located outsidethe first moat trench, and a third semiconductor substrate materialportion 104C that is located between the first moat trench and thesecond moat trench. Each of the first moat trench and the second moattrench may have any annular shape such as a rectangular annular shape, arounded rectangular annular shape, a circular annular shape, anelliptical annular shape, or any two-dimensional annular shape whenviewed from the top-down. The buried insulator layer 102 may include aninsulator material such as silicon oxide, silicon nitride, or aluminumoxide. Other suitable materials within the contemplated scope ofdisclosure may also be used. The stack of the handle substrate 100, theburied insulator layer 102, and the semiconductor substrate materialportions (104A, 104B, 104C) may be provided as a silicon-on-insulatorsubstrate. The buried insulator layer 102 can have a thickness in arange from 50 nm to 500 nm, although lesser and greater thicknesses canalso be used.

The region including the first semiconductor substrate material portion104A can be used as a high voltage region of a semiconductor chip 10.The first semiconductor substrate material portion 104A may be laterallysurrounded by a first moat trench isolation structure 106 that fills thefirst moat trench and by a second moat trench isolation structure 108that fills the second moat trench. In an embodiment, the second moattrench isolation structure 108 may have a second width w2 that is lessthan half the first width w1 of the first moat trench isolationstructure 106.

In an embodiment, the first moat trench isolation structure 106 mayinclude dielectric sidewall spacers 110 of an insulating material. Thedielectric sidewall spacers 110 may include an inner dielectric sidewallspacer 110 a that is laterally surrounded by a conductive moat fillmaterial portion 113, and an outer dielectric sidewall spacer 110 b thatlaterally surrounds the conductive moat fill material portion 113.Suitable insulating material include, but are not limited to siliconoxide. Other suitable materials within the contemplated scope ofdisclosure may also be used. The outer dielectric sidewall spacer 110 band the inner dielectric spacer 110 a can have a same lateral width.Located between the dielectric sidewall spacers 110 of insulatingmaterial in the first deep trench isolation trench 106 is the conductivemoat fill material portion 113. Each of the outer dielectric sidewallspacer 110 b, the inner dielectric spacer 110 a, and the conductive fillstructure 113 can be topologically isomorphic to a torus, i.e., has arespective shape that may be deformed into a torus without forming ordestroying a hole in any surface thereof.

In one embodiment, the second moat trench isolation structure 108includes a dielectric moat trench fill structure 111. The dielectricmoat trench fill structure 111 may include the same material as theouter dielectric sidewall spacer 110 b and the inner dielectric spacer110 a. According to an embodiment of the present disclosure, the secondmoat trench isolation structure 108 can have a lateral width that isgreater than the lateral width of each of the outer dielectric sidewallspacer 110 b and the inner dielectric spacer 110 a, and may be less thantwice the lateral width of each of the outer dielectric sidewall spacer110 b and the inner dielectric spacer 110 a. In one embodiment, thedielectric moat trench fill structure 111, the outer dielectric sidewallspacer 110 b, and the inner dielectric spacer 110 a can consistessentially of silicon oxide. The lateral thickness of the outerdielectric sidewall spacer 110 b and the inner dielectric spacer 110 amay be in a range from 50 nm to 300 nm, although lesser and greaterthicknesses can also be used.

In an embodiment, a first diffusion barrier layer 112A may be optionallyprovided between each insulating dielectric sidewall spacer 110 a, 110 band sidewalls of the second semiconductor substrate material portion104B and the third semiconductor substrate material portion 104C. Theoptional first diffusion barrier layers 112A may be formed byconformally depositing a dielectric diffusion barrier material such assilicon nitride in the first moat trench and the second moat trenchprior to depositing the insulating material of the dielectric sidewallspacers 110 a, 110 b.

If the first diffusion barrier layers 112A are provided in the firstdeep trench isolation moat structure 106, a second diffusion barrierlayer 112B may be provided in the second deep trench as a component ofthe second moat trench isolation structure 108. The second diffusionbarrier layer 112B can be a continuous material layer having the samematerial composition and the same thickness as the first diffusionbarrier layers 112A. The first diffusion barrier material layers 112Aand the second diffusion barrier material layer 112B includes adiffusion-blocking dielectric material such as silicon nitride, and mayhave a thickness in a range from 4 nm to 30 nm, although lesser andgreater thicknesses can also be employed.

First semiconductor devices 710 can be formed on, and/or within portionsof, the first semiconductor substrate material portion 104A. Secondsemiconductor devices 720 can be formed on, and/or within portions of,the second semiconductor substrate material portion 104B. In oneembodiment, the first semiconductor devices 710 comprise at least onebipolar-CMOS-DMOS (BCD) device. In one embodiment, at least one of thefirst semiconductor devices 710 can have an operating voltage in a rangefrom 50 volts to 1,000 volts. The region of the first semiconductordevices 710 can be a high voltage region, which can include a powerregion containing power semiconductor devices. The region of the secondsemiconductor devices 720 can be a low voltage region comprising adigital region and an analog region. In one embodiment, all of thesecond semiconductor devices 720 can have an operating voltage less than50 V, and/or less than 24 V, and/or less than 12 V, and/or less than 6V.

A contact-level dielectric layer 760 can be formed over the firstsemiconductor devices 710 and the second semiconductor devices 720.Contact via structures 115 may be formed through the contact-leveldielectric layer 760 contacting the top surface of the conductive moatfill material portion 113 in the first moat trench isolation structure106.

With reference to FIGS. 2A and 2B, a second exemplary semiconductorstructure 15 including a triple moat trench isolation structure inaccordance with some embodiments is disclosed. While the secondexemplary structure illustrates an embodiment in which the diffusionbarrier layers (112A, 112B) are not used, embodiments are expresslycontemplated herein in which the diffusion barrier layers (112A, 112B)are used in conjunction with the variations in the second exemplarystructure with respect to the first exemplary structure.

As in the first exemplary semiconductor structure 10, the secondexemplary semiconductor structure 15 includes a first moat trenchisolation structure 106 and a second moat trench isolation structure 108that electrically isolate a high voltage region from lower voltageregions of the semiconductor chip. However, in this embodiment, a thirdmoat trench isolation structure 118 is additionally provided inside thesecond moat trench isolation structure 108. Similar to the second moattrench isolation structure 108, the third moat trench isolationstructure 118 has a third width w3 that may be less than half the firstwidth w1 of the first moat trench isolation structure 106. The thirdwidth w3 of the third moat trench isolation structure 118 may be same asthe second width w2 of the second moat trench isolation structure 108,or may be different, i.e. larger or smaller. Put another way, a width ofthe first moat trench isolation structure 106 may be at least twice awidth of the second (108) and/or third (118) of the at least two moattrench isolation structures. The addition of the third moat trenchisolation structure 118 provides additional electrical isolationrelative to the embodiment illustrated in FIGS. 1A and 1B. In an aspectof this embodiment, further additional moat trench isolation structuresmay be provided as desired.

FIG. 3 illustrates an embodiment of a semiconductor structure 300, suchas a BCD device, comprising a deep trench isolation structure inaccordance with some embodiments. The semiconductor structure 300 mayhave at least one high voltage region 114 and at least one lower voltageregion 302, 304. The high voltage region 114 may contain devices thatoperate at voltages greater than 10V, such as greater than 50V, such asgreater than 100V, such as greater than 200V. The lower voltage regions302, 304 have devices that operate at voltages less then 10V. In anembodiment, the semiconductor structure 300 includes a low voltageanalog region 302 which typically comprises bipolar junction transistorsand a low voltage digital region 304 which comprises CMOS field effecttransistors. The high voltage region may include DMOS field effecttransistors designed to distribute power to other regions of the chip.Surrounding the high voltage region are two moat trench isolationstructures 106, 108 which electrically isolate the low voltage analogregion 302 and the low voltage digital region 304 from the high voltageregion.

FIG. 4 is a schematic illustration of a semiconductor structure 300according to FIG. 3 with more details. The top portion of FIG. 4illustrates a separate bipolar analog device 402, a separate digitalCMOS device 404 and a separate high voltage DMOS device 406. Asillustrated in the bottom portion of FIG. 4, the separate bipolar analogdevice 402, digital CMOS device 404 and high voltage DMOS device 406 maybe integrated into a single chip having a low voltage analog region 302,a low voltage digital region 304 and a high voltage region. As discussabove, the low voltage analog region 302 may comprise bipolar junctiontransistors having a base B, an emitter E and a collector C. The lowvoltage digital region 304 may comprise pnp-npn complementary metaloxide semiconductor transistors having sources S, drains D and gates G.The high voltage region may include double diffused metal oxidesemiconductor transistors having sources S, drains D and gates G.

FIG. 5 is a flow diagram of an embodiment method 500 of making a deeptrench isolation structure. FIGS. 6A-6G illustrate sequential verticalcross-sectional views of an exemplary structure during an exemplarymanufacturing process using the embodiment method 500.

In a first step 502 of the method as illustrated in FIG. 6A, a substrateincluding a semiconductor device layer 104L may be covered with an etchmask layer 611. The substrate can include a handle substrate 100, aburied insulating layer 102, and the semiconductor device layer 104L. Inan embodiment, the etch mask layer 611 may comprise a layer stackincluding, from bottom to top, a silicon oxide pad layer 610 and asilicon nitride hard mask layer 612. The silicon oxide pad layer 610 canhave a thickness in a range from 5 nm to 50 nm, and the silicon nitridehard mask layer 612 can have a thickness in a range from 50 nm to 300nm, although lesser and greater thicknesses can be used for each.Alternatively, the etch mask layer 611 can include a photoresist layer.

In a second step 504, the etch mask layer 611 can be patterned asillustrated in FIG. 6B. If the etch mask layer 611 includes a stack ofthe silicon oxide pad layer 610 and a silicon nitride hard mask layer612, a photoresist layer can be applied over the etch mask layer 611,and can be lithographically patterned to form a pattern of openingshaving the same pattern as the pattern of the moat trenches (i.e., 106,108) illustrated in FIGS. 1A, 1B, 2A, and 2B. Unmasked portions of thehard mask layer can be etched by an anisotropic etch process. Thephotoresist layer can be subsequently removed, for example, by ashing.In embodiments in which the etch mask layer 611 includes a photoresistlayer, the etch mask layer 611 can be patterned by lithographic exposureand development.

In a third step 506, the semiconductor device layer 104L and the buriedinsulator layer 102 may be etched using the patterned etch mask layer611 as an etch mask. Moat trenches (i.e., 106, 108) including at leastthe first moat trench and the second moat trench may be formed throughthe semiconductor device layer 104L and the buried insulating layer 102.The semiconductor device layer 104L may be divided into multiplesemiconductor substrate material portions (104A, 104B, 104C) by theanisotropic etch process such as a reactive ion etching process.

In an optional step 507 illustrated in FIG. 6D, an optional continuousdiffusion barrier layer 112L can be deposited using a conformaldeposition process. For example, the continuous diffusion barrier layer112L can be deposited by a low pressure chemical vapor depositionprocess. The continuous diffusion barrier layer 112L includes adiffusion-blocking dielectric material such as silicon nitride, and canhave a thickness in a range from 4 nm to 40 nm, although lesser andgreater thicknesses can also be used.

In a fourth step 508, a continuous insulating material layer 110L can bedeposited using a conformal deposition process. For example, thecontinuous insulating material layer 110L can be deposited by a lowpressure chemical vapor deposition process. The continuous insulatingmaterial layer 110L may fill the entirety of the unfilled volume of thesecond moat trench 108 and any additional moat trench (i.e. 111), ifpresent, but does not entirely fill the first moat trench 106. Thethickness of the continuous insulating material layer 110L in the firstmoat trench 106 can be in a range from 50 nm to 300 nm, although lesserand greater thicknesses can also be used. The continuous insulatingmaterial layer 110L includes an insulating material such as siliconoxide. According to an aspect of the present disclosure, the second moattrench 108 and any additional moat trench (e.g., 111) may be filled withthe insulating material of the continuous insulating material layer 110Lto form a dielectric moat trench fill structure because the second widthw2 of the second moat trench 108 and the width of any additional moattrench (e.g., 111) is equal to, or less than, one half the first widthw1 of the first moat trench 106.

In a fifth step 510 illustrated in FIG. 6E, an anisotropic etch processmay be performed to remove horizontal portions of the continuousinsulating material layer 110L that overlie the patterned etch masklayer 611 (in embodiments in which the patterned etch mask layer 611includes a layer stack of the silicon oxide pad layer 610 and thesilicon nitride hard mask layer 612). An annular horizontal portion ofthe continuous insulating material layer 110L located between innervertically-extending portions of the continuous insulating materiallayer 110L and outer vertically-extending portions of the continuousinsulating material layer 110L may be removed. Further, the anisotropicetch process can remove physically exposed portions of the continuousdiffusion barrier layer 112L.

Each remaining portion of the continuous diffusion barrier layer 112L inthe first moat trench 106 constitutes a first conformal diffusionbarrier layer 112A, and the remaining portion of the continuousdiffusion barrier layer 112L in the second moat trench 108 constitutes asecond conformal diffusion barrier layer 112B. The first conformaldiffusion barrier layers 112A include an inner conformal diffusionbarrier layer 112A that contacts sidewalls of the third semiconductorsubstrate material portion 104C and an outer conformal diffusion barrierlayer 112A that contacts sidewalls of the second semiconductor substratematerial portion 104B, The second conformal diffusion barrier layer 112Bmay be formed as a single continuous layer without any openingtherethrough, and can contact sidewalls of the first semiconductorsubstrate material portion 104A, sidewalls of the third semiconductorsubstrate material portion 104C, and a top surface of the handlesubstrate 100.

Each remaining portion of the continuous insulating material layer 110Lin the first moat trench 106 constitutes a dielectric sidewalls spacer110, and the remaining portion of the continuous insulating materiallayer 110L in the second moat trench constitutes a dielectric moattrench fill structure 111. The dielectric sidewall spacers 110 includean inner dielectric sidewall spacer 110 a located inside an annularcavity in the first moat trench 106 and an outer dielectric sidewallsspacer 110 b located outside the annular cavity in the first moat trench106. The dielectric moat trench fill structure 111 may be formed as acontinuous annular structure. An annular top surface of the handlesubstrate 100 may be physically exposed at the bottom of the first moattrench 106 between the inner dielectric sidewall spacer 110 a and outerdielectric sidewalls spacer 110 b.

In a sixth step 512 illustrated in FIG. 6F, a conductive moat fillmaterial can be deposited in the annular cavity inside the first moattrench 106 directly on the physically exposed annular surface of thehandle substrate 100. In one embodiment, the handle substrate 100 caninclude a semiconductor material such as single crystalline silicon. Theconductive moat fill material may include a doped semiconductor materialsuch as doped polysilicon, or may include at least one metallic materialsuch as a combination of a conductive metallic nitride (such as TiN,TaN, and/or WN) and a conductive metallic fill material (such astungsten). Other suitable materials within the contemplated scope ofdisclosure may also be used. Excess portions of the conductive moat fillmaterial can be removed from above the top surface of the patterned etchmask layer 611. A recess etch can be used to vertically recess theconductive moat fill material. An overetch may be performed tovertically recess remaining portions of the conductive moat fillmaterial inside the first moat trench such that the remaining portionsof the conductive moat fill material in the first moat trench has anannular top surface located below the topmost surface of the patternedetch mask layer 611 and at, or above, the horizontal plane including thetop surface of the first semiconductor substrate material portion 104A.Alternatively, or additionally, a chemical mechanical planarizationprocess may be used to recess the conductive moat fill material. Theremaining annular portion of the conductive moat fill material in thefirst moat trench constitutes a conductive moat fill material portion113. The conductive moat fill material portion 113 can be topologicallyhomeomorphic to a torus. The set of all material portions in the firstmoat trench constitutes a first moat trench isolation structure 106, andthe set of all material portions in the second moat trench constitutes asecond moat trench isolation structure 108.

In the next step 514 and referring to FIG. 6G, the patterned etch masklayer 611 can be removed selective to the semiconductor substratematerial portions (104A, 104B, 104C) and the moat trench isolationstructures (106, 108). For example, the silicon nitride hard mask layer612 may be removed by a wet etch process using hot phosphoric acid. Thesilicon oxide pad layer 610 may be removed by a wet etch process usinghydrofluoric acid. First semiconductor devices 710 can be formed on,and/or in a portion of, the first semiconductor substrate materialportion 104A, and second semiconductor devices 720 can be formed on,and/or in a portion of, the second semiconductor substrate materialportion 104B.

Referring to FIG. 6H, a contact-level dielectric layer 760 can be formedover the first semiconductor devices 710 and the second semiconductordevices 720. The contact via structures 115 can be formed throughcontact-level dielectric layer 760 directly on the top surface of theconductive moat fill material portion 113 in the first moat trenchisolation structure 106. The contact via structures 115 can be used toelectrically bias the conductive moat fill material portion 113 and thehandle substrate 110 to provide suitable electrical bias, and toelectrically isolate the first semiconductor devices 710.

Embodiments of the structures and methods above provide greaterelectrical isolation between high voltage regions and low voltageregions on the same chip. This allows the integration different types ofsemiconductor devices on the same chip. By combining the functionalitythat had previously been on separate chips into a single integratedchip, the number of chips for a given application can be reduced.Consequently, real estate on circuit boards may be freed up as fewerchips may be required. Thus, the cost of assembly may also be lowered.

According to an aspect of the present disclosure, a semiconductorstructure may be provided, which comprises: at least a firstsemiconductor device 710 located on a first semiconductor substratematerial portion 104A located in a high voltage region; at a secondsemiconductor device 720 located on a second substrate material portion104B located outside the high voltage region; a first moat trenchisolation structure 106 electrically insulating the first semiconductorsubstrate material portion 104A from the second semiconductor substratematerial portion 104B; and a second moat trench isolation structure 108electrically insulating the first semiconductor substrate materialportion 104A from the second semiconductor substrate material portion104B and laterally surrounding the first semiconductor substratematerial portion 104A and laterally surrounded by the first moat trenchisolation structure 106.

According to another aspect of the present disclosure, a semiconductorstructure may be provided, which comprises: at least one firstsemiconductor device 710 located on a first semiconductor substratematerial portion 104A located in a high voltage region; at least onesecond semiconductor device 720 located on a second semiconductorsubstrate material portion 104B located in a low voltage region; a setof at least two nested moat trench isolation structures (106, 108)laterally surrounding the high voltage region and electricallyinsulating the high voltage region from the low voltage region. One ofthe at least two moat trench isolation structures (106, 108) is filledwith at least one dielectric material and another of the at least twomoat trench isolation structures (106, 108) comprises an innerdielectric sidewall spacer 110, an outer dielectric sidewall spacer 110,and a conductive moat fill material portion 113 located between theinner dielectric sidewall spacer 110 and the outer dielectric sidewallspacer 110.

According to yet another aspect of the present disclosure, a method ofmaking a semiconductor structure is provided, which comprises: forming apatterned etch mask layer 611 over a semiconductor device layer 104L ofa substrate (100, 102, 104L); forming at least two moat trenches in thesemiconductor device layer 104L by transferring a pattern in thepatterned etch mask layer 611 into the semiconductor device layer 104Lusing an anisotropic etch process, wherein the at least two moattrenches surrounds a first semiconductor substrate material portion 104Aof the semiconductor device layer (104A, 104B, 104C) and is laterallysurrounded by a second semiconductor substrate material portion 1094B ofthe semiconductor device layer (104A, 104B, 104C); forming insulatingsidewall spacers 110 a, 110 b on sidewalls of a first moat trench 106while filling the second moat trench 108, 118 with the insulatingsidewall spacer material; and filling a remaining empty space in thefirst moat trench 106 with a conductive moat fill material 113.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of making a semiconductor structurecomprising: forming a patterned etch mask layer over a semiconductordevice layer of a substrate; forming at least two moat trenches in thesemiconductor device layer by transferring a pattern in the patternedetch mask layer into the semiconductor device layer using an anisotropicetch process, wherein the at least two moat trenches surrounds a firstsemiconductor substrate material portion of the semiconductor devicelayer and is laterally surrounded by a second semiconductor substratematerial portion of the semiconductor device layer; forming insulatingsidewall spacers on sidewalls of a first moat trench while filling asecond moat trench with the insulating sidewall spacer material; andfilling a remaining empty space in the first moat trench with aconductive moat fill material.
 2. The method of claim 1, wherein: thesubstrate comprises a handle substrate, a buried insulator layeroverlying the handle substrate, and the semiconductor device layeroverlying the buried insulator layer; and the at least two moat trenchesare formed through the semiconductor device layer and the buriedinsulator layer down to a top surface of the handle substrate.
 3. Themethod of claim 2, further comprising removing portions of theconductive fill material that overlie a top surface of the semiconductordevice layer, wherein a remaining portion of the conductive fillmaterial comprises a conductive fill material portion contacting the topsurface of the handle substrate.
 4. The method of claim 3, furthercomprising forming contact via structures on a top surface of theconductive fill material portion.
 5. The method of claim 2, furthercomprising conformally depositing an insulating material in the firstmoat trench and in the second moat trench, wherein the insulatingmaterial fills a cavity in the second moat trench and a continuouscavity that laterally surrounds inner sidewalls of the first moat trenchis present within the first moat trench after deposition of theinsulating material.
 6. The method of claim 5, further comprisinganisotropically etching the insulating material, wherein: a portion ofthe insulating material that contacts inner sidewalls of the first moattrench constitutes an inner dielectric sidewall spacer; and a portion ofthe insulating material that contacts outer sidewalls of the second moattrench comprises an outer dielectric sidewall spacer.
 7. The method ofclaim 5, further comprising: depositing a conformal diffusion barrierlayer prior to depositing the insulating material; and physicallyremoving the top surface of the handle substrate after forming an innerdielectric sidewall spacer and an outer dielectric sidewall spacer. 8.The method of claim 1, further comprising: forming first semiconductordevices on a first semiconductor substrate material portion; and formingsecond semiconductor devices on a second semiconductor substratematerial portion, wherein: the first semiconductor devices comprise abipolar-CMOS-DMOS (BCD) device; and at least one of the firstsemiconductor devices has an operating voltage in a range from 50 voltsto 1,000 volts.
 9. A method of making a semiconductor structurecomprising: covering a substrate with an etch mask layer, wherein thesubstrate comprises a handle substrate, a buried insulating layer, and asemiconductor layer; patterning the etch mask layer; forming a firstdeep trench moat and a second deep trench moat by etching thesemiconductor layer and the buried insulator layer using the patternedetch mask layer; conformally depositing an insulating material layer onsidewalls of the first deep trench moat such that the first deep trenchmoat is partially filled; conformally depositing the insulating materiallayer in the second deep trench moat such that the second deep trenchmoat is entirely filled with the insulating material layer to form asecond moat isolation structure; forming dielectric sidewall spacers inthe first deep trench moat and exposing an annular top surface of thehandle substrate at a bottom of the first deep trench moat; depositing aconductive material in the first deep trench moat to form a first moatisolation structure; forming first semiconductor devices on a firstsemiconductor substrate material portion; and forming secondsemiconductor devices on a second semiconductor substrate materialportion.
 10. The method of claim 9, wherein forming the first deeptrench moat and the second deep trench moat by etching the semiconductorlayer and the buried insulator layer comprises performing a reactive ionetching process.
 11. The method of claim 9, further comprising:conformally depositing a diffusion barrier layer in the first deeptrench moat and the second deep trench moat, wherein: the diffusionbarrier layer deposited in the first deep trench moat contacts sidewallsof a second semiconductor substrate material portion and sidewalls of athird semiconductor substrate material portion; and the diffusionbarrier layer deposited in the second deep trench moat contactssidewalls of a first semiconductor substrate material portion andsidewalls of the third semiconductor substrate material portion.
 12. Themethod of claim 11, wherein the diffusion barrier layer in the firstdeep trench moat and the second deep trench moat comprises siliconnitride and is conformally deposited using a low pressure chemical vapordeposition process.
 13. The method of claim 11, further comprising:vertically recessing the conductive material in a first moat trench suchthat the conductive material in the first moat trench has an annular topsurface located below a topmost surface of the patterned etch masklayer.
 14. The method of claim 13, further comprising: removing thepatterned etch mask selective to the substrate prior to both forming thefirst semiconductor devices and forming the second semiconductordevices.
 15. The method of claim 13, further comprising: depositing acontact-level dielectric layer over the first semiconductor devices andthe second semiconductor devices; forming contact via structures throughthe contact-level dielectric layer on a top surface of the conductivematerial in the first deep moat trench.
 16. A method of making asemiconductor structure comprising: covering a substrate with an etchmask layer, wherein the substrate comprises a handle substrate, a buriedinsulating layer, and a semiconductor layer; patterning the etch masklayer; forming a first deep trench moat, a second deep trench moat, anda third deep moat trench by etching the semiconductor layer and theburied insulator layer using the patterned etch mask layer; conformallydepositing an insulating material layer on sidewalls of the first deeptrench moat such that the first deep trench moat is partially filled;conformally depositing the insulating material layer in the second deeptrench moat and the third deep trench moat such that the second deeptrench moat and the third deep trench moat are both entirely filled withthe insulating material layer to form a second moat trench isolationstructure and a third moat trench isolation structure, respectively;forming dielectric sidewall spacers in the first deep trench moat andexposing an annular top surface of the handle substrate at a bottom ofthe first deep trench moat; depositing a conductive material in thefirst deep trench moat to form a first moat trench isolation structure;forming first semiconductor devices on a first semiconductor substratematerial portion; forming second semiconductor devices on a secondsemiconductor substrate material portion; and forming thirdsemiconductor devices on a third semiconductor substrate materialportion.
 17. The method of claim 16, wherein forming the first moattrench isolation structure forms the first moat trench isolationstructure with a width that is at least twice a width of the second moattrench isolation structure.
 18. The method of claim 17, wherein thewidth of the first moat trench isolation structure is at least twice awidth of the third moat trench isolation structure.
 19. The method ofclaim 16, wherein forming the first semiconductor devices on the firstsemiconductor substrate material portion comprises forming high voltagesemiconductor devices.
 20. The method of claim 19, wherein forming thesecond semiconductor devices on the second semiconductor substratematerial portion comprises forming low voltage semiconductor devices.